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Si anisotropic etching

Si anisotropic etching

Anisotropic etching of Si is a technique that utilizes the crystal axis orientation of Si to create half-holes and through-holes. For example, when a Si wafer (type #100) is anisotropically etched, sharp and high-precision patterning is possible at an angle of 54.7 degrees to the crystal axis direction. For more details, please feel free to "Contact Us."

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